| Job Open for SCCM Packaging Engineer _Chicago IL at Chicago, Illinois, USA |
| Email: [email protected] |
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http://bit.ly/4ey8w48 https://jobs.nvoids.com/job_details.jsp?id=2205712&uid= Packaging Engineer Location: Chicago IL Onsite: Hybrid (3 days, Tues, Wed, Thu working from client office) Job Description: 1. Experience level 8-10 years. 2. Responsible for building and deploying application packages for the enterprise utilizing tools such as Java, JRE, JDK, etc. 3. Approx 5 years of experience in using JAVA, JRE, JDK tools for application deployment 4. Experience in professional services to collaborate cross functionally to successfully develop solutions. 5. Experience in creating solution for business requirements and maintain core engineering solutions 6. Excellent Communication and customer and stakeholder management and collaboration. Warm Regards Iyyappaswamy Sr Resource Manager Tekshapers Inc 850 Stephenson Hwy, Suite 205 , Troy, MI 48083 (W): 248-565-4747 Ext -144 ; (C): -+1-248-306-8440 Email: [email protected] | https://www.tekshapers.com/ MBE Certified | ISO 9001:2008 | Tekshapers is an equal opportunity employer and will consider all applications without regards to race, sex, age, color, religion, national origin, veteran status, disability, sexual orientation, gender identity, genetic information or any characteristic protected by law. * Disclaimer: This E-Mail may contain Confidential and/or legally privileged Information and is meant for the intended recipient(s) only. If you have received this e-mail in error and are not the intended recipient/s, kindly notify us at [email protected] and then delete this e-mail immediately from your system. You are also hereby notified that any use, any form of reproduction, dissemination, copying, disclosure, modification, distribution, and/or publication of this e-mail, its contents, or its attachment/s other than by its intended recipient/s is strictly prohibited and may be unlawful. Internet communication cannot be guaranteed to be secured or error-free as information could be delayed, intercepted, corrupted, lost, or contain viruses. Tekshapers. does not accept any liability for any errors, omissions, viruses or computer problems experienced by any recipient as a result of this e-mail. -- Keywords: cprogramm information technology Illinois Michigan Job Open for SCCM Packaging Engineer _Chicago IL [email protected] http://bit.ly/4ey8w48 https://jobs.nvoids.com/job_details.jsp?id=2205712&uid= |
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| 12:39 AM 26-Feb-25 |