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Urgent Need Packaging Engineer Location: Chicago IL at Chicago, Illinois, USA
Email: [email protected]
Birlasoft Requirements

Role: Packaging Engineer

Location: Chicago IL

Remote/ Onsite: Hybrid (3 days, Tues, Wed, Thu working from client office)

Linkedin Profile

Passport number 

JD Points

Experience level 8-10 years.

Responsible for building and deploying application packages for the enterprise utilizing tools such as Java, JRE, JDK, etc.

Approx 5 years of experience in using JAVA, JRE, JDK tools for application deployment

Experience in professional services to collaborate cross functionally to successfully develop solutions.

Experience in creating solutions for business requirements and maintaining core engineering solutions

Excellent Communication and customer and stakeholder management and collaboration.

Regards,

Kranthi Thanda
Manager - Recruitment 

CsxTech INC. 
Email: [email protected]
Mobile: 469-424-2838 
Direct-469-443-4705 Office: 972-379-7181*117 | Fax: 972-379-7182 

Address

: 4975 Preston Park Blvd, Suite # 55, Plano, Texas-75093.
LinkedIn https://www.linkedin.com/in/kranthi-goud-1a747a56/

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Keywords: information technology Illinois
Urgent Need Packaging Engineer Location: Chicago IL
[email protected]
[email protected]
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08:51 PM 26-Feb-25


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Location: Chicago, Illinois